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SUSS MA6



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Seller : #3856 (ULRS)
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Description : SUSS MA6 top and bottom Mask Aligner The Suss MA6 is a top and bottom side contact printer used for fine line lithography down to 1 micron or better. The system includes a number of unique features including: 350 W mercury arc lamp with smart power supply capable of operating in constant power mode, constant intensity @ 365nm or constant intensity @ 405nm. In the constant intensity mode, as the lamp deteriorates, the power is automatically adjusted to keep the intensity at the selected wavelength constant. Also the Intensity at each wavelength may be read from the power supply during exposure or during a lamp test. Top side of wafer alignment using a conventional microscope, wafer and mask stage assemblies. Also bottom side alignment using bottom viewing optics, CCD imaging with frame grabber and TV monitor. This allows registration of features on the backside of a wafer to the top side of the same wafer (e.g. through the wafer vias or backside window etching for membrane formation etc.) Automatic computer control with LCD status and user prompting and keypad entry. Up to 20 programs may be stored with 4 on line at any one time. Each program may be edited for key parameters pertinent to the contact mode. 1 of 4 contact modes may be programmed including: soft contact, hard contact, vacuum contact and low vacuum contact. Each mode is easily selected by keypad and may have certain parameters changed by the user. Soft contact: WEC pressure (~.2-.3 bar) controls force to push wafer against mask. Hard Contact: Same as soft except N2 pillow pressure gives additional upward force to wafer. Vacuum: Vacuum seal inflates (.2-.3 bar) to form chamber which is evacuated. Pre-Vac time allows vacuum to proceed slowly to prevent alignm
 
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Used-Line Referral Service (ULRS)

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