OXFORD PLASMALAB uEtch 300 RIE / PE ETCHER SYSTEM consisting of:
- Model: 300 RIE / PE (Reactive Ion Etch/Physical Etch)
- Up to 12"/300mm Wafer Capable
- Setup to etch SiO2, Nitrides, or Polymers
- Lower Platten: 380mm diameter (may be upgraded tp 460mm)
- Adixen ATH 400HPC Turbo Pump
- HP Computer with Pentium Dual Core Processor
- Advanced Energy RFG 1251 RF generatorֲ (13.56MHz)
- Plasma mode: RIE/PE recipe controlled
- Wafer stage temperature control:ֲ Neslab RTE-7 chiller
- Gas Box: 6 gas Lines
- Gas Box with 6 MKS 1179A MFC''s installed
- MFC 1 Gas: CHF3, Range: 100 SCCMֲ
- MFC 2 Gas: CF4, Range: 100 SCCM
- MFC 3 Gas: O2, Range: 50 SCCM
- MFC 4 Gas: AR, Range: 100 SCCM
- MFC 5 Gas: N2, Range: 100 SCCM
- MFC 6 Gas:C4F8, Range: 100 SCCM
ֲ -Alcatel 2033C corrosive roughing pump
- CE Marked
- EMO Button
- Chamber Up/Down Selector Switch
- Hoist Up/Down Buttons
- Operations Manuals & System Restore Diskֲ
- Serial Number:ֲ 219819
- System Power: 208V, 3ph, 50/60Hz, 20A
- Fully refurbished to meet all OEM specifications
- Available for full inspection and demonstration!ֲ
REFURBISHED TO MEET OEM SPECIFICATIONS:ֲ
- MFCs rebuilt and calibratedֲ as required
- Vacuum pumps professionally rebuilt as requiredֲ
- Turbo pumpֲ maintenance performed
- All wiring/wire harnesses are checked and repaired or replaced if needed.
- All liquid and air lines, tubing and fittings checked and replaced if needed
- Major components disassembled for checkout, servicing, cleaning, and lubricating. Parts are repaired or replaced as needed.
- Checkout of all electronic and mechanical parts.
- Equipment is fully tested to verify compliance to customer specifications.
- Post-refurbishment system leak and RF calibration checked
- System cycle and repeatability testing completedֲ
- Transport locks installed; all system components carefully packed, labeled, and professionally crated for transport as required