Esec 8003

The Esec 8003 is a semiautomatic wafer dicing saw for wafers up to 6". The Esec 8003 has a programmable spindle speed and variable feed rate to allow for maximum dicing control and repeatability.

Equipment Specifications:

Wafer diameter:    25.4mm-152.4mm (1in.-6in.)

Wafer thickness:    0.01mm-5.0mm (0.3mil-196.9mil)

X-axis (feed):    240mm (9.45in.)

Y-axis (index):    165mm (6.5in.)

Index step:    0.02mm-99.999mm (0.79mil-3937mil)

Z-axis (verticle):    10mm (.393in.)

Rotation angle:    0.01-165 degrees

Spindle speed:    15,000-50,000 rpm

Power requirements:    220VAC, 50/60Hz, 2.5kVa

Air pressure:    64-85 psi

Water pressure:    to 85 psi