Suss

SB6e

Condition:

Excellent Condition Guaranteed.
Fully Reconditioned to Factory Specifications. 
6 Month Warranty and Specifications Guarantee

As-Is / Where-Is Pricing is Also Available. 

SUSS SB6e SUBSTRATE BONDER consisting of:

- Model: SB6e
- Capable of processing up to 6” wafers
- Tooling included for 100mm
- Capable of Anodic Bonding
- Temperature Control to 550 degrees C
- Up to 20kN Bond Force
- Edwards XDS10c Vacuum Pump
- Ulvac DA-60D Diaphragm Vacuum Pump
- Turbo Pump
- Power Supply
- Overpressure Control
- LCD Monitor
- PC Control with Windows 2000 OS
- Operating Manual for Suss SB6e
 
More Info on the Suss SB6e Bonder:

- Chamber Vacuum will reach down to E -5.5m/bar within 5min of pump cycle
- Bond Types Capable: The SB6e is capable of Fusion Bonds, Anodic Bonds,  Eutectic Bond, Glass Fritt Bond, Glue Bond, or Adhesive Bond. 
- Maximum Bond Pressure you can apply to the wafers is 9bar of work pressure which is triangulated to square mm with the surface area of 150mm.
- Alignment Accuracy: the post bond alignment accuracy is in the single micron range from outer left to outer right.
- Max Temperature: the top temperature is 600 degrees C.
If you have any questions about the specifications or capability of the Suss SB6e please call or email our company. 
Configuration:

Suss SB6 Substrate Bonder